Installation
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 Ceramic covering
+ Use of plaster sieve
-Floor base surface must be carefully cleaned from dust and other interfering objects;
 
-Lay reflecting heat insulation material, not subjected to deformations (2 mm technical cork in rolls, insulin PPE-0502, etc.) Heat insulation material must be fixed to the base and its sheets must be fixed together with construction adhesive tape (Moment or other);

- Lay reflecting material (reflecting surface up). To prevent displacement, material must be fixed on base surface and sheets must be fixed each to other with construction adhesive tape (Moment or other);
 
 
-Lay carbon-copper polymer film sheets according to prepared layout, but not closer than 10 cm to the walls. Recommended to lay film in longitudinal room direction, minimizing number of individual sheets, electric connection wires and their connections. Observe that upper side is that where graphite stripes overlay copper stripes on sheet edges, during laying. For uniform heating lay sheets as close to each other as possible, preventing their overlapping, however. To prevent sheets from moving, they must be fixed with construction adhesive tape to reflecting material and between themselves. In order to improve leveling mortar layer catch with the base, make technological openings through the film and heat insulation material. Make them sized 2 x 5 cm in places where carbon or copper strips will not be touched (film cutting edge). Desirable distance between technological openings is 20 cm; -Construct film electrical connection. Sheets are connected to power supply parallel.

    
   
  

Use of plasterboards
 
Process is similar, therefore we will accent different operations only:
 
-No technologic openings in heat insulation material or carbon-copper polymer film;
 
-Cover film with polyethylene sieve (no plastering sieve); 
-Lay moisture-resistant plasterboards (3-6 mm thick) over polyethylene film. Plasterboards must be fixed to the floor base with dowels and screws. Fixings must be located with 15-30 cm intervals, but they may not damage carbon or copper strips (recommended making them in film cutting edges). Plasterboards must be primed with “concrete-contact”;
 
-Start laying ceramic tiles.
 
Each of the mentioned methods has its advantages and weaknesses. E.g., plasterboard method treats carbon-copper polymer film more carefully – it has no direct contact with aggressive environment (concrete mortar, tile adhesive, etc.), but plasterboards will without doubts be more difficult to fix to the floor base without damaging carbon and copper strips.
 
Important!!!
Having finished tiling works, you may switch on electric floor  after approx. 20 days only, i.e., after complete curing of mortar and adhesive (duration depends on construction materials used)! Tile floor maximum temperature is not necessary to limit, if only it does not cause discomfort. Maximum temperature of most thermal regulators does not exceed 40 ˚C). 
Placing objects on the floor will hinder heat exchange and cause rapid floor surface temperature rise!
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